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FWF20015 Wafer 2mm 180°Vertical (DIP)

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Specification
Wafer 2mm 180°Vertical 2Circuits (DIP) Wafer 2mm Straight Single row 3Circuits (DIP) Wafer 2mm 180°Vertical 5Circuits (DIP) Wafer 2mm Straight Single row 6Circuits (DIP)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 2.0mm
Height 6.3mm
Electrical
Current - Maximum per Contact 2.00A
Voltage - Maximum 100V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Gold/Tin
Material - Plating Termination Gold/Tin
Material - Resin PA66 UL94V-2

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FWF20015 Wafer 2mm 180°Vertical (DIP)

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