你当前的浏览器版本过低或不支持。请升级或更换浏览器。推荐浏览器 Chrome Edge。

Series image: for reference only

FWF25006 Wafer 2.5mm 90°Angle (DIP)

ViewProduct Specification

Export Page to PDF
Specification
Wafer 2.5mm 90°Angle 2Circuits (DIP) Wafer 2.5mm 90°Angle 3Circuits (DIP) Wafer 2.5mm 90°Angle 4Circuits (DIP) Wafer 2.5mm 90°Angle 5Circuits (DIP) Wafer 2.5mm 90°Angle 6Circuits (DIP) Wafer 2.5mm 90°Angle 7Circuits (DIP)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 2.5mm
Height 8.0mm
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-2

Sales Drawings

x

{{concat.title}}Product:{{concat.code}}

Content{{concat.content}}

EnquireTXGA

Relevant Products

FWF25006 Wafer 2.5mm 90°Angle (DIP)

Copy to my email address:{{encryptEmail}}
>Copy to my email address:Please move to personal center to bind your email address first
Please enter customer part number.
Don’t show this pop up window next time

No need

Confirm

New Version Notification
This page has been discontinued and no longer supports purchasing. Please visit the new version page for selection and purchase
Go immediately