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Updated time:2019-12-10 14:29:26

FWF08001 Wafer 0.80mm 180°Vertical  (SMT)

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FWF08001 Wafer 0.80mm 180°Vertical (SMT)
  • Type: Wafer 0.80mm 180°Vertical (SMT)
  • EU RoHS: Compliant(2011/65/EU)
  • EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
  • EU ELV: Compliant(2000/53/EC)
  • Lead time: 1week

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Product Specification
Category Wafer 180°Vertical (SMT)
Circuits 2-12,14,16,.20
Pitch 0.8mm
Height 2.8mm
Current - Maximum per Contact 0.50A
Voltage - Maximum 30V
Contact Resistance 20 mΩ Max
Insulation Resistance 100 MΩ Min
Withstanding Voltage 200V AC r.m.s
Temperature Range operating -25ºC~+85ºC
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Gold/Tin
Material - Plating Termination Gold/Tin
Material - Resin PA9T UL94V-0
Compatible Parts
Pulg FHG08001,FHG08002
Receptacle -
Terminal FT08001
Assembly shell -




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FWF08001 Wafer 0.80mm 180°Vertical (SMT)

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