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Updated time:2019-12-10 14:29:49

FWF25402-B Wafer 2.54mm 90°Angle (DIP)

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FWF25402-B Wafer 2.54mm 90°Angle (DIP)
  • Type: Wafer 2.54mm 90°Angle (DIP)
  • EU RoHS: Compliant(2011/65/EU)
  • EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
  • EU ELV: Compliant(2000/53/EC)
  • Lead time: 1week

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Product Specification
Category
Category Wafer 90°Angle (DIP)
Circuits 2-12
Pitch 2.54mm
Height 13.6mm
Electrical
Current - Maximum per Contact 2.50A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1000V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal 磷青铜
Material - Plating Mating
Material - Plating Termination
Material - Resin PA66 UL94V-2
Compatible Parts
Pulg FHG25401
Receptacle -
Terminal FHG25401
Assembly shell -
x

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FWF25402-B Wafer 2.54mm 90°Angle (DIP)

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