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FWF50801 Wafer 5.08mm 180°Vertical (DIP)

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Specification
Wafer 5.08mm 180°Vertical 4Circuits (DIP)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 5.08mm
Height 10.4mm
Electrical
Current - Maximum per Contact 10.00A
Voltage - Maximum 250V
Contact Resistance 25 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0

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FWF50801 Wafer 5.08mm 180°Vertical (DIP)

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