Where you are: TXGAProductsFWF63501

Updated time:2019-12-10 14:30:04

FWF63501 Wafer 6.35mm 180°Vertical  (DIP)

Series image: for reference only

FWF63501 Wafer 6.35mm 180°Vertical (DIP)
  • Type: Wafer 6.35mm 180°Vertical (DIP)
  • EU RoHS: Compliant(2011/65/EU)
  • EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
  • EU ELV: Compliant(2000/53/EC)
  • Lead time: 1week

ViewProduct Specification

Need more information?

Product Category

Clear Filters

Part Number & Description Status Lead time Unit price MPQ Stock(pcs) MOQ Quantity Action



{{ product.status == 1?'In production':(product.status == 2?'Inactive':'Discontinued')}} 1 weeks In stock

View Price N/A

{{product.mpq}} {{product.stock}} 0 1 {{product.moq}}

View cart

Add to cart

Contact us

for replacement

Contact us

for quotation

Product Specification
Category Wafer 180°Vertical (DIP)
Circuits 2-5
Pitch 6.35mm
Height 14.7mm
Current - Maximum per Contact 10.00A
Voltage - Maximum 600V
Contact Resistance 25 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 5000V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
Compatible Parts
Pulg FHG63501
Receptacle -
Terminal FT63502
Assembly shell -




Relevant Products

FWF63501 Wafer 6.35mm 180°Vertical (DIP)

Copy to my email address:{{encryptEmail}}
No result is found. Please try again with new keyword.
Please enter customer part number.
Don’t show this pop up window next time

No need


Sign in
Forgot password

No account,Create an account

Third-party login in

Register with Mobile Number

Register with Email

Mr Miss

Already a member,Sign in