你当前的浏览器版本过低或不支持。请升级或更换浏览器。推荐浏览器 Chrome Edge。

FWF20005-D32S22W5B

Product number: FWF20005-D32S22W5B
Category: Wire to Board Connectors
Specification: Pitch:2.00mm
Type: Socket
Mounting Style: Through Hole
Angle: 180°Vertical
Circuits: 32Circuits
Status: Active
Description: Wafer 2mm 180°Vertical, 32Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2024-05-13
MPQ: 1000
MOQ: 1000
Type: Wafer 2mm 180°Vertical (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 2.0mm
Height 6.5mm
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA46 UL94V-0
FFH25421-D08S1004K6K
Female Header 2.54mm 180°Vertical Double row 8Circuits(SMT)
FFH25425-D06S1004K6M
Female Header 2.54mm 180°Vertical Double row 6Circuits(SMT)
FHG30003-D24F2K6B
Wire to board housing 3mm 24Circuits
FPH20021-D10S100106B
Pin Header 2mm 180°Vertical Double row 10Circuits(DIP)
FPH25453-D10S1014352125B
Pin Header 2.54mm ,Double row ,10Circuits ,180° Vertical(DIP) ,1μ" ,PA6T
FWF25002-S07B22W1B
Wafer 2.5mm 90°Angle 7Circuits(DIP)
Quantity Unit Price
1 $0.167009
10 $0.157102
50 $0.137286
100 $0.127378
500 $0.107563
1000 $0.079919
2500 $0.078825
5000 $0.077730
10000 $0.076635
25000 $0.075540

* Please jump to latest version page view prices for purchasing

Sales Drawings

Product number: {{currentProduct.code}}
Product information: {{currentProduct.descCn}}
Order quantity: {{currentProduct.num}}
Cart ({{myCartItems.length}}Item)
Total amount:
{{isCn?'¥':'$'}}{{cartProductTotal}}
New Version Notification
This page has been discontinued and no longer supports purchasing. Please visit the new version page for selection and purchase
Go immediately