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FWF39603-S07S22TB

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF39603 series.pdf
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Product number: FWF39603-S07S22TB
Category: Wire to Board Connectors
Specification: Pitch:3.96mm
Type: Socket
Mounting Style: Through Hole
Angle: 180°Vertical
Circuits: 7Circuits
Status: Active
Description: Wafer 3.96mm 180°Vertical 7Circuits (DIP)
Stock(pcs): 50
Lead time: 50 In stock
Estimated delivery date when out of stock 2024-05-10
MPQ: 1000
MOQ: 1000
Type: Wafer 3.96mm 180°Vertical (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 3.96mm
Height 12.6mm
Electrical
Current - Maximum per Contact 6.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
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Ejector Box Header 2mm 90°Angle 44Circuits(DIP)
FID12708-064R1L
Micro match 1.27mm 180°Vertical 6Circuits
FPH12721-D10S100417B
Pin Header 1.27mm 180°Vertical Double row 10Circuits(DIP)
FPH25422-D12B101403B
Pin Header 2.54mm ,Double row ,12Circuits ,90° Angle(DIP) ,1μ" ,PA6T
Quantity Unit Price
1 $0.131175
10 $0.122760
50 $0.105931
100 $0.097516
500 $0.080687
1000 $0.053366
2500 $0.052638
5000 $0.051909
10000 $0.051180
25000 $0.050452

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Sales Drawings

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