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FBB04007-M Board to Board 0.4mm SMT

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Specification
Board to Board 0.4mm ,MALE ,20Circuits ,180° Vertical(SMT)(H2=1.31mm) Board to Board 0.4mm ,MALE ,20Circuits ,180° Vertical(SMT)(H2=2.26mm)

Product Specification

Category
Category Board to board - Male Pitch:0.4mm (SMT)
Mating height 1.5,2,2.5,3,3.5mm
Pitch 0.4mm
Durabiliy (mating cycles max) 30
Electrical
Current - Maximum per Contact 0.30A
Voltage - Maximum 60V
Contact Resistance 70 mΩ Max
Withstanding Voltage 100V AC r.m.s
Temperature Range operating -55ºC~+85ºC
Insulation Resistance 100 MΩ Min
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Gold
Material - Plating Termination Gold
Material - Resin LCP UL94V-0

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FBB04007-M Board to Board 0.4mm SMT

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