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FWF25018 Wafer 2.5mm 180°Vertical (DIP)

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Specification
Wafer 2.5mm 180°Vertical 4Circuits (DIP) Wafer 2.5mm 180°Vertical 5Circuits (DIP)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 2.5mm
Height 7.0mm
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Brass
Material - Plating Mating Gold/Tin
Material - Plating Termination Gold/Tin
Material - Resin PA6T UL94V-0/PA66 UL94V-0

Specifications

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FWF25018 Wafer 2.5mm 180°Vertical (DIP)

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