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FWF30021 Wafer 3mm 180°Vertical (SMT)

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Specification
Wafer 3mm 180°Vertical 2Circuits (SMT) Wafer 3mm 180°Vertical 3Circuits (SMT) Wafer 3mm 180°Vertical 4Circuits (SMT) Wafer 3mm 180°Vertical 5Circuits (SMT) Wafer 3mm 180°Vertical 6Circuits (SMT) Wafer 3mm 180°Vertical 7Circuits (SMT) Wafer 3mm 180°Vertical 8Circuits (SMT) Wafer 3mm 180°Vertical 9Circuits (SMT) Wafer 3mm 180°Vertical 10Circuits (SMT) Wafer 3mm 180°Vertical 11Circuits (SMT) Wafer 3mm 180°Vertical 12Circuits (SMT)

Product Specification

Category
Category Wafer 180°Vertical (SMT)
Pitch 3.00mm
Height 9.90mm
Electrical
Current - Maximum per Contact 5.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Brass
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin LCP UL94V-0

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FWF30021 Wafer 3mm 180°Vertical (SMT)

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