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FWF42004 Wafer 4.2mm 90°Angle (DIP)

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Specification
Wafer 4.2mm 90°Angle 2Circuits (DIP) Wafer 4.2mm 90°Angle 4Circuits (DIP) Wafer 4.2mm 90°Angle 6Circuits (DIP) Wafer 4.2mm 90°Angle 8Circuits (DIP) Wafer 4.2mm 90°Angle 10Circuits (DIP) Wafer 4.2mm 90°Angle 12Circuits (DIP) Wafer 4.2mm 90°Angle 14Circuits (DIP) Wafer 4.2mm 90°Angle 16Circuits (DIP) Wafer 4.2mm 90°Angle 18Circuits (DIP) Wafer 4.2mm 90°Angle 20Circuits (DIP) Wafer 4.2mm 90°Angle 22Circuits (DIP) Wafer 4.2mm 90°Angle 24Circuits (DIP)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 4.2mm
Height 12.80mm
Electrical
Current - Maximum per Contact 9.00A
Voltage - Maximum 250V
Contact Resistance 15 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -40℃+105℃
Material and Plating
Material-Metal Brass
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0

Specifications

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FWF42004 Wafer 4.2mm 90°Angle (DIP)

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