TXGA board-to-board connector, designed for miniature, high-speed, high-density and high-power applications

With the development and progress of science and technology, electronic products are increasingly inclined to the development of lighter and thinner and higher performance. In the limited equipment space, as many functions as possible must be integrated, and at the same time, it must have a high degree of reliability and durability. In the face of increasingly complex connection systems, TXGA conforms to market needs and develops and produces board-to-board connectors designed for miniature, high-speed, high-density and high-power applications, and realizes safe interconnection of systems in miniaturized designs for partners.

Performance parameter

Maximum current per contact 3A

Voltage-Max 250V

Contact resistance 15 mΩ Max

Insulation resistance 5000 MΩ Min

Withstand voltage 675V AC r.m.s

Product advantages

Small and compact high-density design, pin digits up to 500

Lightweight 0.8mm combined height

Data transmission speed up to 56G, meeting high-speed transmission needs

Mating life up to 50 times

Can work under the environment of -55ºC~+125ºC

0.04mm pitch-2.54 pitch can be customized

Application industry

TXGA board-to-board connectors are suitable for industrial automation, communication networks, medical equipment, smart homes, digital products, military manufacturing, office equipment and other fields.

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TXGA board-to-board connector, designed for miniature, high-speed, high-density and high-power applications