What is the difference between misted tin plating and bright tin plating on connectors

The selection of coating for connectors is a key link that directly affects the performance, lifespan, quality, and cost of connectors. Therefore, the best electroplating method is to meet application requirements at the lowest cost, avoiding excessive performance redundancy and increasing production costs. Tin plating is a commonly used process for connectors, which includes two types of electroplating: fog tin plating and bright tin plating. Although there is only a word difference between the two processes, there are significant differences in practical applications:
1： The surface of products coated with misted tin is dull and matte, with no luster. The surface of products coated with bright tin is bright and beautiful.
2： The crystallization of fog tin electroplating is relatively rough. The addition of brightening agent to bright tin makes the crystal more delicate and shiny.
3： Mist tin plating has better solderability, while bright tin plating has poorer solderability and is prone to tin whiskers.
4： Mist tin has better high-temperature resistance, while bright tin has poor performance and is prone to secondary melting of tin at high temperatures.
5： Mist tin has a higher cost than bright tin.
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