The TXGA power/signal hybrid board to board (FPC) connector adopts a hybrid core design, with 4-position power contacts and 4-position signal contacts, which can simultaneously transmit power and signals. The rated current of the power contact is 3A, and the rated current of the signal contact is 0.3A, which can meet the stable data transmission requirements in different application scenarios. The center to center spacing of the product is only 0.4mm, and the combination height is only 0.8mm. Its compact appearance effectively saves installation space and provides a highly reliable interconnection solution for equipment.
Product Features
Stable simultaneous interpreting
The TXGA power/signal hybrid board to board (FPC) connector is designed with a hybrid core, consisting of 4 signals and 4 power positions. The power contacts support 3A current, while the signal contacts support 0.3A current. It can achieve stable synchronous transmission of power and signals, and ensure the normal operation of equipment in different application scenarios.
high reliability
Adopting an 8-digit and double row structure, the power and signal contact positions are reasonably arranged to make the contact force distribution more uniform, effectively avoiding the risk of contact loosening caused by vibration or impact, and improving contact reliability.
Space saving
The center to center spacing of the product is 0.4mm, and the combined height is only 0.8mm. The compact design facilitates power transmission and reliable signal integrity for compact devices and devices with narrow application scenarios.
Product parameters
Number of bits: 8 bits (4 signals+4 power supplies)
Center distance: 0.4mm
Power supply current (maximum): 3A
Signal current (maximum): 0.3A
Voltage (maximum): 30V
Contact resistance: 50 m Ω Max
Insulation resistance: 500 M Ω Min
Voltage endurance: 100V AC r.m.s
Application industry
communication devices
medical equipment
computer
wearable devices
Industrial Automation
