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FHG12507-S08M2W1B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications:
Product specification.pdf
Sales Drawings:
FHG12507 Series.pdf
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Product number: FHG12507-S08M2W1B
Category: Wire to Board Connectors
Specification: Pitch:1.25mm
Type: Plug
Mounting Style: Crimp Housings
Angle: 180°Vertical
Circuits: 8Circuits
Status: Active
Description: Wire to board housing 1.25mm 8Circuits
Stock(pcs): 471
Lead time: 471 In stock
Estimated delivery date when out of stock {{2026-03-17|timezoneDate}}
MPQ: 1000
MOQ: 1000
Type: Wire to board housing 1.25mm
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wire to board housing
Pitch 1.25mm
Temperature Range operating -25ºC~+85ºC
Material and Plating
Material - Resin PA66 UL94V-0
FHG25401-S09M2W5B
Wire to board housing 2.54mm 9Circuits
FPH12701-S04S100404B
Pin Header 1.27mm 180°Vertical Single row 4Circuits(DIP)
FPH20072-D14S1014110907M
Pin Header 2mm ,Double row ,14Circuits ,180° Vertical(SMT) ,1μ" ,PA6T
FPH25449-S10S1014190715B
Pin Header 2.54mm ,Single row ,10Circuits ,180° Vertical(DIP) ,1μ" ,PA6T
FWF12505-S02S24W5M
Wafer 1.25mm 180°Vertical 2Circuits (SMT)
FWF20023-S07S23W5M
Wafer 2mm ,7Circuits ,180° Vertical(SMT)
Quantity Unit Price
1+ {{0.454743|tr}}
10+ {{0.423959|tr}}
50+ {{0.362391|tr}}
100+ {{0.331608|tr}}
500+ {{0.270041|tr}}

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Specifications

Sales Drawings

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