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FHG12507-S13M2W1B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications:
Product specification.pdf
Sales Drawings:
FHG12507 Series.pdf
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Product number: FHG12507-S13M2W1B
Category: Wire to Board Connectors
Specification: Pitch:1.25mm
Type: Plug
Mounting Style: Crimp Housings
Angle: 180°Vertical
Circuits: 13Circuits
Status: Active
Description: Wire to board housing 1.25mm 13Circuits
Stock(pcs): 800
Lead time: 800 In stock
Estimated delivery date when out of stock {{2026-03-17|timezoneDate}}
MPQ: 1000
MOQ: 1000
Type: Wire to board housing 1.25mm
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wire to board housing
Pitch 1.25mm
Temperature Range operating -25ºC~+85ºC
Material and Plating
Material - Resin PA66 UL94V-0
FBH25419-D18S1004K6B01
Box Header 2.54mm 180°Vertical 18Circuits(DIP)
FCD423-7M
Micro SD card connector(H2.1mm)(Push to Push)
FFC05008-34SBA124W5M
FPC/FFC connector 0.5mm Upper contact 34Circuits(H1.2)(SMT)
FFH25424-D08S1014K6K
Female Header 2.54mm 180°VerticalDouble row 8Circuits(DIP)(1μ'')
FHG25011-S07F2K6B
Wire to board housing 2.5mm 7Circuits(Black)
FWF12508-S20B24W5M
Wafer 1.25mm 90°Angle 20Circuits (SMT)
Quantity Unit Price
1+ {{0.597821|tr}}
10+ {{0.559471|tr}}
50+ {{0.482772|tr}}
100+ {{0.444422|tr}}
500+ {{0.367723|tr}}

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Specifications

Sales Drawings

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