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FHG25009-S08M2W1B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
Drawing-FHG25009.pdf
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Product number: FHG25009-S08M2W1B
Category: Wire to Board Connectors
Specification: Pitch:2.50mm
Type: Plug
Mounting Style: Crimp Housings
Angle: 180°Vertical
Circuits: 8Circuits
Status: Active
Description: Wire to board housing 2.5mm 180°Vertical 8Circuits(JC)
Stock(pcs): 0
Lead time: Estimated delivery date {{2026-06-12|timezoneDate}}
MPQ: 1000
MOQ: 1000
Type: Wire to board housing 2.5mm
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wire to board housing
Pitch 2.5mm
Temperature Range operating -25ºC~+85ºC
Material and Plating
Material - Resin PA66 UL94V-0
FBB05002-F10S1003K6MH40
Board to Board 180°Vertical 0.5mm 10Circuits(H1=4mm)
FFH20026-S05S1004K6M1-B
Female Header 2mm 180°Vertical Single row 5Circuits(SMT)
FFH25419-D18S1004K6M
Female Header 2.54mm 180°Vertical Double row 18Circuits(SMT)
FPH20067-S16S1014070807M
Pin Header 2mm ,Single row ,16Circuits ,180° Vertical(SMT) ,1μ" ,PA6T
FPH25460-S04B1014070407B
Pin Header 2.54mm ,Single row ,4Circuits ,90° Angle(DIP) ,1μ" ,PA6T
FWF25019-S08B22W1B
Wafer 2.5mm 90°Angle 8Circuits (DIP)
Quantity Unit Price
1+ {{0.146680|tr}}
10+ {{0.136750|tr}}
50+ {{0.116891|tr}}
100+ {{0.106961|tr}}
500+ {{0.087103|tr}}

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Sales Drawings

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