FWF12507-S13B24W5B Wafer 1.25mm 90°Angle 13Circuits (DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications：

Product specification.pdf

Sales Drawings：

FWF12507 series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

Export Page to PDF

Product number：	FWF12507-S13B24W5B
Category：	Wire to Board Connectors
Specification：	Pitch:1.25mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	90° Angle
Circuits：	13Circuits
Status：	Active
Description：	Wafer 1.25mm 90°Angle 13Circuits (DIP)
Stock(pcs)：	30
Lead time：	30 In stock Estimated delivery date when out of stock {{2026-03-13\|timezoneDate}}
MPQ：	1000
MOQ：	1000
Type：	Wafer 1.25mm 90°Angle (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (DIP)
Pitch	1.25mm
Height	4.7mm
Electrical
Current - Maximum per Contact	1.00A
Voltage - Maximum	125V
Contact Resistance	20 mΩ Max
Insulation Resistance	100 MΩ Min
Withstanding Voltage	250V AC r.m.s
Temperature Range operating	-25ºC~+85ºC
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA46 UL94V-0