FWF12508-S30B24W5M Wafer 1.25mm 90°Angle 30Circuits (SMT)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

FWF12508.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF12508-S30B24W5M
Category：	Wire to Board Connectors
Specification：	Pitch:1.25mm
Type：	Socket
Mounting Style：	SMT
Angle：	90° Angle
Circuits：	30Circuits
Status：	Active
Description：	Wafer 1.25mm 90°Angle 30Circuits (SMT)
Stock(pcs)：	171
Lead time：	171 In stock Estimated delivery date when out of stock {{2026-07-27\|timezoneDate}}
MPQ：	1500
MOQ：	1500
Type：	Wafer 1.25mm 90°Angle (SMT)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (SMT)
Pitch	1.25mm
Height	2.5mm
Electrical
Current - Maximum per Contact	1.00A
Voltage - Maximum	125V
Contact Resistance	20 mΩ Max
Insulation Resistance	100 MΩ Min
Withstanding Voltage	250V AC r.m.s
Temperature Range operating	-25ºC~+85ºC
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA46 UL94V-0