FWF12513-S08S24W5M Wafer 1.25mm 180°Vertical 8Circuits (SMT)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications：

Product specification.pdf

Sales Drawings：

FWF12513 Series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

Export Page to PDF

Product number：	FWF12513-S08S24W5M
Category：	Wire to Board Connectors
Specification：	Pitch:1.25mm
Type：	Socket
Mounting Style：	SMT
Angle：	180°Vertical
Circuits：	8Circuits
Status：	Active
Description：	Wafer 1.25mm 180°Vertical 8Circuits (SMT)
Stock(pcs)：	911
Lead time：	911 In stock Estimated delivery date when out of stock {{2026-06-13\|timezoneDate}}
MPQ：	1000
MOQ：	1000
Type：	Wafer 1.25mm 180°Vertical (SMT)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 180°Vertical (SMT)
Pitch	1.25mm
Height	4.05mm
Electrical
Current - Maximum per Contact	1.00A
Voltage - Maximum	125V
Contact Resistance	20 mΩ Max
Insulation Resistance	100 MΩ Min
Withstanding Voltage	250V AC r.m.s
Temperature Range operating	-25ºC~+85ºC
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA9T UL94V-0