FWF15001-S03S26W5B Wafer 1.5mm 180°Vertical 3Circuits (DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications：

Product specification.pdf

Sales Drawings：

FWF15001 series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

Export Page to PDF

Product number：	FWF15001-S03S26W5B
Category：	Wire to Board Connectors
Specification：	Pitch:1.50mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	180°Vertical
Circuits：	3Circuits
Status：	Active
Description：	Wafer 1.5mm 180°Vertical 3Circuits (DIP)
Stock(pcs)：	1300
Lead time：	1300 In stock Estimated delivery date when out of stock 2025-08-21
MPQ：	2000
MOQ：	2000
Type：	Wafer 1.5mm 180°Vertical (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 180°Vertical (DIP)
Pitch	1.5mm
Height	4.5mm
Electrical
Current - Maximum per Contact	1.00A
Voltage - Maximum	50V
Contact Resistance	20 mΩ Max
Insulation Resistance	500 MΩ Min
Withstanding Voltage	500V AC r.m.s
Temperature Range operating	-25ºC~+85ºC
Material and Plating
Material-Metal	Brass
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA46 UL94V-0