FWF25009-S03S22W1B Wafer 2.5mm 180°Vertical 3Circuits (DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

FWF25009 Series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF25009-S03S22W1B
Category：	Wire to Board Connectors
Specification：	Pitch:2.50mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	180°Vertical
Circuits：	3Circuits
Status：	Active
Description：	Wafer 2.5mm 180°Vertical 3Circuits (DIP)
Stock(pcs)：	30
Lead time：	30 In stock Estimated delivery date when out of stock 2026-01-24
MPQ：	1000
MOQ：	1000
Type：	Wafer 2.5mm 180°Vertical (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 180°Vertical (DIP)
Pitch	2.5mm
Height	10.6mm
Electrical
Current - Maximum per Contact	3.00A
Voltage - Maximum	250V
Contact Resistance	20 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	800V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA66 UL94V-0