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FWF25032-S03B22BNB

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF25032 Series.pdf
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Product number: FWF25032-S03B22BNB
Category: Wire to Board Connectors
Specification: Pitch:2.50mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 3Circuits
Status: Active
Description: Wafer 2.5mm ,3Circuits ,90° Angle(DIP) ,Brown
Stock(pcs): 0
Lead time: Estimated delivery date 2025-10-29
MPQ: 2000
MOQ: 2000
Type: Wafer 2.5mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 2.5mm
Electrical
Current - Maximum per Contact 2.50A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃~+85℃
Material and Plating
Material-Metal Brass
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
F0P0CT-08004120-01
Pin ,∅8 ,Silver plated ,3μm (16mm²)
FBH12708-D96S1004K6KA
Box Header 1.27mm 180°Vertical 96Circuits(SMT)
FBH25421-D60S1001G1K
Ejector Box Header 2.54mm 60Circuits(Bump)
FDP0706-F0DS103K6KA
Hight Current D-sub 180°Vertical Female 7Circuits(7W2)(3μ'')(10A)
FID20006-125BKB
IDC 2mm (3 Assemblies) ,12Circuits
FWF42001-D18S22TK
Wafer 4.2mm 180°Vertical 18Circuits (DIP)
Quantity Unit Price
1 $0.039937
10 $0.037233
50 $0.031826
100 $0.029123
500 $0.023716
1000 $0.014143
2500 $0.013950
5000 $0.013758
10000 $0.013566
25000 $0.013373

* Please jump to latest version page view prices for purchasing

Sales Drawings

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