FWF25403-S08B22W1B-A Wafer 2.54mm 90°Angle 8Circuits (DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications：

Product specification.pdf

Sales Drawings：

FWF25403.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

Export Page to PDF

Product number：	FWF25403-S08B22W1B-A
Category：	Wire to Board Connectors
Specification：	Pitch:2.54mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	90° Angle
Circuits：	8Circuits
Status：	Active
Description：	Wafer 2.54mm 90°Angle 8Circuits (DIP)
Stock(pcs)：	0
Lead time：	Estimated delivery date {{2026-06-12\|timezoneDate}}
MPQ：	1000
MOQ：	1000
Type：	Wafer 2.54mm 90°Angle (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (DIP)
Pitch	2.54mm
Height	11.35mm
Electrical
Current - Maximum per Contact	2.50A
Voltage - Maximum	250V
Contact Resistance	20 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	800V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Gold/Tin
Material - Plating Termination	Gold/Tin
Material - Resin	PA66 UL94V-2