FWF25405-S11B12K6B Wafer 2.54mm 90°Angle 11Circuits (DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

FWF25405.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF25405-S11B12K6B
Category：	Wire to Board Connectors
Specification：	Pitch:2.54mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	90° Angle
Circuits：	11Circuits
Status：	Active
Description：	Wafer 2.54mm 90°Angle 11Circuits (DIP)
Stock(pcs)：	0
Lead time：	Estimated delivery date {{2026-07-27\|timezoneDate}}
MPQ：	1000
MOQ：	1000
Type：	Wafer 2.54mm 90°Angle (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (DIP)
Pitch	2.54mm
Height	13.60mm
Electrical
Current - Maximum per Contact	2.50A
Voltage - Maximum	250V
Contact Resistance	20 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	800V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Gold
Material - Plating Termination	Gold
Material - Resin	PBT UL94V-0