FWF30001-D08S22K6K Wafer 3mm 180°Vertical 8Circuits (DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications：

Product specification.pdf

Sales Drawings：

FWF30001 Series.pdf

3D Models：

FWF30001-D14S22K6B.stp

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

Export Page to PDF

Product number：	FWF30001-D08S22K6K
Category：	Wire to Board Connectors
Specification：	Pitch:3.00mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	180°Vertical
Circuits：	8Circuits
Status：	Active
Description：	Wafer 3mm 180°Vertical 8Circuits (DIP)
Stock(pcs)：	248
Lead time：	248 In stock Estimated delivery date when out of stock 2025-12-14
MPQ：	180
MOQ：	2000
Type：	Wafer 3mm 180°Vertical (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 180°Vertical (DIP)
Pitch	3.00mm
Height	10mm
Electrical
Current - Maximum per Contact	5.00A
Voltage - Maximum	250V
Contact Resistance	10 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	1500V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA9T UL94V-0