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FWF30001-D18S22K6B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications:
Product specification.pdf
Sales Drawings:
FWF30001 Series.pdf
3D Models:
FWF30001-D14S22K6B.stp
Export Page to PDF
Product number: FWF30001-D18S22K6B
Category: Wire to Board Connectors
Specification: Pitch:3.00mm
Type: Socket
Mounting Style: Through Hole
Angle: 180°Vertical
Circuits: 18Circuits
Status: Discontinued
Description: Wafer 3mm 180°Vertical 18Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2024-04-29
MPQ: 500
MOQ: 500
Type: Wafer 3mm 180°Vertical (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 3.00mm
Height 10mm
Electrical
Current - Maximum per Contact 5.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA9T UL94V-0
F1JL24-S16SD000-01
JL24 ,Socket ,16Circuits ,180°Vertical ,Through Hole
FFH25405-D52S1001K6K
Female Header 2.54mm 180°Vertical Double row 52Circuits(DIP)
FFH25405-S12S1004K6K
Female Header 2.54mm 180°Vertical Single row 12Circuits(DIP)
FHG42002-D24F2TB
Wire to board housing 4.2mm 24Circuits
FWF50809-S04S22TB
Wafer 5.08mm 180°Vertical 4Circuits (DIP)
Quantity Unit Price
1 $0.361408
10 $0.340854
50 $0.299747
100 $0.279194
500 $0.238087
1000 $0.185746
2500 $0.183193
5000 $0.180640
10000 $0.178087
25000 $0.175533

Specifications

Sales Drawings

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