FWF30003-D18B22K6B Wafer 3mm 90°Angle 18Circuits (DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications：

Product specification.pdf

Sales Drawings：

FWF30003 series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

Export Page to PDF

Product number：	FWF30003-D18B22K6B
Category：	Wire to Board Connectors
Specification：	Pitch:3.00mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	90° Angle
Circuits：	18Circuits
Status：	Discontinued
Description：	Wafer 3mm 90°Angle 18Circuits (DIP)
Stock(pcs)：	0
Lead time：	Estimated delivery date {{2026-04-27\|timezoneDate}}
MPQ：	1000
MOQ：	1000
Type：	Wafer 3mm 90°Angle (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (DIP)
Pitch	3.00mm
Height	10mm
Electrical
Current - Maximum per Contact	5.00A
Voltage - Maximum	250V
Contact Resistance	10 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	1500V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA66 UL94V-0