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FWF30003-D18B22K6B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications:
Product specification.pdf
Sales Drawings:
FWF30003 series.pdf
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Product number: FWF30003-D18B22K6B
Category: Wire to Board Connectors
Specification: Pitch:3.00mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 18Circuits
Status: Discontinued
Description: Wafer 3mm 90°Angle 18Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2025-10-24
MPQ: 1000
MOQ: 1000
Type: Wafer 3mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 3.00mm
Height 10mm
Electrical
Current - Maximum per Contact 5.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
F00SMA-P50P0BSW-01
SMA ,Plug ,50Ohm ,pin ,90° Angle ,Nut lock ,Crimp
FBB08004-F40S3103K6M
Board to Board 0.8mm ,Female ,40Circuits ,180° Vertical(SMT) (15G)
FDB3702-F0DB300K6KB
D-SUB 90°Angle Female 37Circuits(Black)
FFH25428-S08S1014K6M
Female Header 2.54mm ,Single row ,8Circuits ,180° Vertical(SMT) ,1μ" ,PA6T
FID25408-124K6K
IDC 2.54mm 12Circuits(3 Assemblies)
FWF30024-D08B23BKM
Wafer 3mm ,8Circuits ,90° Angle(SMT)
Quantity Unit Price
1 $0.325324
10 $0.306823
50 $0.269820
100 $0.251319
500 $0.214317
1000 $0.167201
2500 $0.164903
5000 $0.162605
10000 $0.160306
25000 $0.158008

Specifications

Sales Drawings

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