FWF30026-D08B25BKM Wafer 3mm ,8Circuits ,90° Angle(SMT) ,PA9T

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

FWF30026 Series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF30026-D08B25BKM
Category：	Wire to Board Connectors
Specification：	Pitch:3.00mm
Type：	Socket
Mounting Style：	SMT
Angle：	90° Angle
Circuits：	8Circuits
Status：	Active
Description：	Wafer 3mm ,8Circuits ,90° Angle(SMT) ,PA9T
Stock(pcs)：	0
Lead time：	Estimated delivery date {{2026-03-18\|timezoneDate}}
MPQ：	200
MOQ：	1000
Type：	Wafer 3mm 90°Angle (SMT)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (SMT)
Pitch	3.00mm
Electrical
Current - Maximum per Contact	5.00A
Voltage - Maximum	250V
Contact Resistance	10 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	1000V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Brass
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA9T UL94V-0