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TXGA连接器厂家 Building Technology Cornerstone
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FWF39604-S10B22TB

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF39604 series.pdf
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Product number: FWF39604-S10B22TB
Category: Wire to Board Connectors
Specification: Pitch:3.96mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 10Circuits
Status: Active
Description: Wafer 3.96mm 90°Angle 10Circuits (DIP)
Stock(pcs): 20
Lead time: 20 In stock
Estimated delivery date when out of stock {{2026-10-13|timezoneDate}}
MPQ: 500
MOQ: 1000
Type: Wafer 3.96mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 3.96mm
Height 12.6mm
Electrical
Current - Maximum per Contact 6.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
FBB05002-M38S1003K6MH20
Board to Board 180°Vertical 0.5mm 38Circuits(H2=2mm)
FBB08005-F40S3103K6MH70
Board to Board 0.8mm ,Female ,40Circuits ,180° Vertical(SMT) (28G)
FFH25407-D26S1004K6K
Female Header 2.54mm 180°Vertical Double row 26Circuits(DIP)
FPH127S2-D20S100403B
Pin Header 1.27mm 180°Vertical Double row 20Circuits(SMT)
FPH20048-D40S1014150716B
Pin Header 2.00mm ,Double row ,40Circuits ,180° Vertical(DIP) ,1μ" ,PA6T
FPH25401-S40S100117B
Pin Header 2.54mm 180°Vertical Single row 40Circuits(DIP)
Quantity Unit Price
1+ {{1.515770|tr}}
10+ {{1.425848|tr}}
50+ {{1.246001|tr}}
100+ {{1.156079|tr}}
500+ {{0.976233|tr}}

* Please jump to latest version page view prices for purchasing

Sales Drawings

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