FWF42007-S03B22TK Wafer4.2mm 90°Angle 3Circuits (DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications：

Product specification.pdf

Sales Drawings：

FWF42007 Series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

Export Page to PDF

Product number：	FWF42007-S03B22TK
Category：	Wire to Board Connectors
Specification：	Pitch:4.20mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	90° Angle
Circuits：	3Circuits
Status：	Active
Description：	Wafer4.2mm 90°Angle 3Circuits (DIP)
Stock(pcs)：	287
Lead time：	287 In stock Estimated delivery date when out of stock 2025-07-03
MPQ：	1000
MOQ：	1000
Type：	Wafer4.2mm 90°Angle (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (DIP)
Pitch	4.2mm
Height	12.45mm
Electrical
Current - Maximum per Contact	9.00A
Voltage - Maximum	600V
Contact Resistance	10 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	1500V AC r.m.s
Temperature Range operating	-40℃+105℃
Material and Plating
Material-Metal	Brass
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA66 UL94V-0