FWF63509-S08B22W1K Wafer 6.35mm 90°Angle 8Circuits (DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

Drawing-FWF63509.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF63509-S08B22W1K
Category：	Wire to Board Connectors
Specification：	Pitch:6.35mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	90° Angle
Circuits：	8Circuits
Status：	Active
Description：	Wafer 6.35mm 90°Angle 8Circuits (DIP)
Stock(pcs)：	0
Lead time：	Estimated delivery date {{2026-03-13\|timezoneDate}}
MPQ：	500
MOQ：	1000
Type：	Wafer 6.35mm 90°Angle (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (DIP)
Pitch	6.35mm
Height	17.27mm
Electrical
Current - Maximum per Contact	15.00A
Voltage - Maximum	600V
Contact Resistance	3.5 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	5000V AC r.m.s
Temperature Range operating	-40℃+105℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA66 UL94V-0