TXGA公告
FWF25402-B Wafer 2.54mm 90°Angle (DIP)

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FWF25402-B Wafer 2.54mm 90°Angle (DIP)

  • Type: Wafer 2.54mm 90°Angle (DIP)
  • EU RoHS: Compliant(2011/65/EU)
  • EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
  • EU ELV: Compliant(2000/53/EC)
  • Lead time: 1week

ViewProduct Specification

TXGA Industrial Electronics (S.Z.) Co., Ltd

7/F, B / 9 Bldg, Baoneng Technology Park, Qingxiang Road, Longhua New District, Shenzhen, China

Zip code:518131

Support Hotline:

0755-2810 2800


Product Category
Wafer 2.54mm 90°Angle 2Circuits (DIP) Wafer 2.54mm 90°Angle 3Circuits (DIP) Wafer 2.54mm 90°Angle 4Circuits (DIP) Wafer 2.54mm 90°Angle 5Circuits (DIP) Wafer 2.54mm 90°Angle 6Circuits (DIP) Wafer 2.54mm 90°Angle 7Circuits (DIP)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 2.54mm
Height 13.6mm
Electrical
Current - Maximum per Contact 2.50A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1000V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal 磷青铜
Material - Plating Mating
Material - Plating Termination
Material - Resin PA66 UL94V-2

Sales Drawings

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FWF25402-B Wafer 2.54mm 90°Angle (DIP)

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