FWF30002 Wafer 3mm 90°Angle (DIP)

Series image: for reference only

FWF30002 Wafer 3mm 90°Angle (DIP)

  • Type: Wafer 3mm 90°Angle (DIP)
  • EU RoHS: Compliant(2011/65/EU)
  • EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
  • EU ELV: Compliant(2000/53/EC)
  • Lead time: 1week

ViewProduct Specification

TXGA Industrial Electronics (S.Z.) Co., Ltd

7/F, B / 9 Bldg, Baoneng Technology Park, Qingxiang Road, Longhua New District, Shenzhen, China

Zip code:518131

Support Hotline:

0755-2810 2800

Product Category
Wafer 3mm 90°Angle 2Circuits (DIP) Wafer 3mm 90°Angle 4Circuits (DIP) Wafer 3mm 90°Angle 6Circuits (DIP) Wafer 3mm 90°Angle 8Circuits (DIP) Wafer 3mm 90°Angle 10Circuits (DIP) Wafer 3mm 90°Angle 12Circuits (DIP) Wafer 3mm 90°Angle 14Circuits (DIP) Wafer 3mm 90°Angle 16Circuits (DIP) Wafer 3mm 90°Angle 18Circuits (DIP) Wafer 3mm 90°Angle 20Circuits (DIP) Wafer 3mm 90°Angle 22Circuits (DIP) Wafer 3mm 90°Angle 24Circuits (DIP)

Product Specification

Category Wafer 90°Angle (DIP)
Pitch 3.00mm
Height 10mm
Current - Maximum per Contact 5.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -40℃+105℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA46 UL94V-0


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FWF30002 Wafer 3mm 90°Angle (DIP)

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