TXGA公告
FWF50803  Wafer 5.08mm 90°Angle 4Circuits (DIP)

Series image: for reference only

FWF50803 Wafer 5.08mm 90°Angle 4Circuits (DIP)

  • Type: Wafer 5.08mm 90°Angle (DIP)
  • EU RoHS: Compliant(2011/65/EU)
  • EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
  • EU ELV: Compliant(2000/53/EC)
  • Lead time: 1week

ViewProduct Specification

TXGA Industrial Electronics (S.Z.) Co., Ltd

7/F, B / 9 Bldg, Baoneng Technology Park, Qingxiang Road, Longhua New District, Shenzhen, China

Zip code:518131

Support Hotline:

0755-2810 2800


Product Category
Wafer 5.08mm 90°Angle 4Circuits (DIP)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 5.08mm
Height 13.2mm
Electrical
Current - Maximum per Contact 10.00A
Voltage - Maximum 250V
Contact Resistance 25 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0

Sales Drawings

x

{{concat.title}}Product:{{concat.code}}

Content{{concat.content}}

EnquireTXGA

Relevant Products

FWF50803 Wafer 5.08mm 90°Angle 4Circuits (DIP)

Copy to my email address:{{encryptEmail}}
Please enter customer part number.
Don’t show this pop up window next time

No need

Confirm

Sign in
Forgot password

No account,Create an account

Sign in with

Register with Mobile Number

Register with Email

{{content}} {{ showmore?'Retract':'Complete your profile'}} Mr Miss Register

Already a member,Sign in