FWF63501 Wafer 6.35mm 180°Vertical  (DIP)

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FWF63501 Wafer 6.35mm 180°Vertical (DIP)

  • Type: Wafer 6.35mm 180°Vertical (DIP)
  • EU RoHS: Compliant(2011/65/EU)
  • EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
  • EU ELV: Compliant(2000/53/EC)
  • Lead time: 1week

ViewProduct Specification

TXGA Industrial Electronics (S.Z.) Co., Ltd

7/F, B / 9 Bldg, Baoneng Technology Park, Qingxiang Road, Longhua New District, Shenzhen, China

Zip code:518131

Support Hotline:

0755-2810 2800

Product Category
Wafer 6.35mm 180°Vertical 2Circuits (DIP) Wafer 6.35mm 180°Vertical 3Circuits (DIP) Wafer 6.35mm 180°Vertical 4Circuits (DIP) Wafer 6.35mm 180°Vertical 5Circuits (DIP)

Product Specification

Category Wafer 180°Vertical (DIP)
Pitch 6.35mm
Height 14.7mm
Current - Maximum per Contact 10.00A
Voltage - Maximum 600V
Contact Resistance 25 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 5000V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0

Sales Drawings





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FWF63501 Wafer 6.35mm 180°Vertical (DIP)

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