In order to meet the requirements of portable, digital and multi-function electronic production, as well as production assembly automation, electronic connectors must be adjusted for product structure. The products are mainly developed in the direction of small size, low height, narrow sound distance, multi-function, long life and surface mounting. The future development of electronic connector technology is described below.
Miniaturization means that the center of the electronic connector (connector) is smaller, and the high density is to achieve large core number. The miniaturization of consumer electronics requires a combination of miniaturization, thinning and high performance, which also promotes the development of connector products towards miniaturization and small pitch. The miniaturization of components requires higher technology. This requires a strong industrial mold base to effectively support.
Nowadays, it is a world of rapid information development. No matter what kind of information or technology is targeted, people's requirements are getting higher and higher. From the rapid development of information communication data, wireless Internet has come to each of us, from the application of smart phones, smart wear, drones, driverless, VR reality, intelligent robots, etc., to install IC chips and The development of intelligent electronic connectors for control circuits is an inevitable trend, as it will enable electronic connectors to more intelligently grasp the use of electronic devices and improve the performance of the connectors themselves to achieve smart wireless bridging.
High-speed transmission means that modern computer, information technology and network technology require the time-scale rate of signal transmission to reach the megahertz band, and the pulse time reaches sub-millisecond, so high-speed transmission electronic connectors are required.
The high frequency is to adapt to the development of millimeter wave technology, and the RF coaxial electronic connectors have entered the millimeter wave working frequency band.
High current is also an important development direction for many electronic connectors. Although short, thin, light, energy-saving and low-cost are the efforts of consumer electronics products, the following two aspects have determined that in a large number of applications, power supply has evolved toward high current. We use common computer CPUs as an example to illustrate the reasons:
First, the computer performance is improved, the CPU operation speed is increased, the number of required transistors is increased, and the power consumption is increased. When the voltage is constant, the current increases in proportion;
Second, with the advancement of semiconductor technology, the operating voltage of the transistor is gradually reduced, which is beneficial to reduce power consumption, but its physical characteristics determine that the power consumption is reduced by less than the voltage. Therefore, the current increase is also a test of the high performance of the electronic connector. An important indicator of development.
Anti-signal interference and shielding, as the data transmission speed increases, the effects of capacitance and impedance become more apparent. Signals on one terminal crosstalk to adjacent terminals and affect their signal integrity. In addition, the ground capacitance reduces the impedance of the high speed signal and attenuates the signal. In the new connector design, each signal transmission terminal is separated from each other. Differential signal pairs do a good job of this because each side of the differential signal pair has a ground pin to reduce crosstalk. Typically the first layer is the area where the legs are opened to separate adjacent ground terminals. The next level is the ground shield installed between the rows. The top layer application will include a metal ground structure surrounding each signal terminal. Such metal shielding achieves the best combination of data transmission speed and signal integrity.
Resistant to extreme environmental use reliability and environmental protection. In the modern high-tech industry, there are many connectors that are used under extreme environmental conditions. In ultra-high temperature, low temperature, vibration, hot and humid environment, corrosive environment, the electronic connector can be effectively used normally, which makes the raw materials in the connector. There are higher requirements in the selection, structural design and processing technology. New high-temperature materials, new electroplating processes, and more flexible alloy materials make future connectors more adaptable to harsh environments.
TXGA Industrial Electronics (S.Z.) Co., Ltd
7/F, B / 9 Bldg, Baoneng Technology Park, Qingxiang Road, Longhua New District, Shenzhen, China