TXGA公告

Future development trend of aviation connector

Since the beginning of the 21st century, China's aviation connector market demand has been maintaining a high growth trend, occupying the largest market share of communication equipment, become the largest consumer group of aviation plug. In communication devices, mobile phones use the most connectors, with an average number of 5-9, and different phones use different connectors.

Now the mobile phone market has begun to intelligent, 5G direction of development, appearance is getting thinner and thinner. The shape is more and more beautiful. In order to meet the demand of mobile phone, aviation connector requires multi-function, low height, good electromagnetic compatibility, and requires miniaturization and customization.

In the future, aviation plugs will first become more and more micro and chip in volume and external size. Currently, there are various connectors of 2.5gb /s and 5.0gb /s with a height of 1.0mm ~ 1.5mm on the market, and the connector spacing of fine spacing is 1.27mm, 1.0mm, 0.8mm, 0.5mm, 0.4mm and 0.3mm. At present, semiconductor chip packaging has begun to develop from 0.5mm to 0.25 space, which directly leads to the number of device pins inside IC devices and the interconnection between devices and boards increasing from several hundred to several thousand, and this technology will become the main technical driving force of interconnection at all levels in the future.

In order to improve the reliability of the connector and ensure the high fidelity of signal transmission, the technology of pressing and matching contact parts will be adopted for the slotted socket of the circular air plug, the elastic stranded pin and the hyperboloid wire spring socket.

TXGA Industrial Electronics (S.Z.) Co., Ltd

7/F, B / 9 Bldg, Baoneng Technology Park, Qingxiang Road, Longhua New District, Shenzhen, China

Zip code:518131

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0755-2810 2800