The demand for high-speed connectors has increased, and the testing focus of traditional connectors has also shifted

With the rapid development of electronic communication technology, integrated circuit packaging and board interconnection, the bandwidth requirements for signal transmission are getting higher and higher, and the transmission rate of interconnection channels is getting faster and faster. As a key part of the entire interconnection system, the connector has become a bottleneck for improving the transmission rate of the system. Therefore, the development of a connector that meets the high-speed transmission performance is the main means to improve the high-speed interconnection performance of the system, and it is also a solution to the high-speed interconnection of the information system. Even the key factor of the problem.

Early low-speed connectors did not need to provide a large amount of signal transmission. For the electrical performance of the connector, only DC conduction and mechanical properties were the key points of the test, such as plugging force, plugging life, terminal retention and contact resistance. Test etc.

With the advent of the era of high-speed communication, the performance requirements of electrical connectors have become more stringent. The transmission line effect caused by its high-speed transmission cannot be ignored. Solving the signal integrity problem of high-speed connectors has become a key factor in connector design. The focus of the connector measurement is also relatively increased by Impedance (characteristic impedance), Propagation Delay (transmission delay), Propagation Skew (transmission time delay), Attenuation (attenuation), Crosstalk (crosstalk) and other test items. To ensure the integrity of the signal transmission and a stable transmission rate.

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