Board-side connectors are connectors that have one end fixed on the circuit board. It has the characteristics of short transmission distance, support for micro-current transmission, signal transmission, abundant models, compact appearance, and more precise design and assembly. The fixing methods of the board end connector are divided into: DIP (perforated fixed) and SMT (surface with dipping). Both methods use solder to assist fixing, but the specific forms are different.
DIP is called dual in-line package in fixed English. It is also called DIP package or DIP package, or DIP or DIL for short. It is an integrated circuit packaging method. DIP packaged components can be mounted on the circuit board using through-hole plug-in technology, or they can be mounted using DIP sockets. The use of DIP sockets can facilitate the replacement of components, and can also avoid overheating of components during soldering.
The full name of SMT is Surface mount (or mounting) technology, which means surface adhesion (or mounting) technology in Chinese. This technology is to mount the components on the surface of the circuit board. The reason why it is called paste is that the solder paste has a certain viscosity and can also stick to the components when it is not melted, so that the connector can be mounted on the circuit board.
The two fixed forms of board end connectors use different production processes. When choosing a process, one should follow the suggestions of professional connector engineers. Under the condition of fully communicating the needs, the connector engineers can consider factors such as price, application, and delivery time to choose a suitable production plan.
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