TXGA Box Header provides various center to center distances such as 1.27mm, 2.00mm, 2.54mm, etc. It has two installation methods: through-hole welding and surface mount. The terminal surface of the connector is treated with gold plating to prevent oxidation, reduce signal interference and loss, and ensure stable data transmission.
TXGA Box Header is connected to IDC connector at the wire end, and the board end is interconnected with the female connector, which can efficiently transmit control signals and weak currents. The product is applied in various electronic devices and can achieve stable and reliable wire to board and board to board connections, meeting the connection requirements of complex circuits inside the device.
Maximum current per contact 1.00A
Voltage - Maximum 250V
Contact resistance 20 m Ω Max
Insulation resistance 500 M Ω Min
Withstand voltage 100V AC r.m.s
Working temperature range -40 º C~+85 º C
EU RoHS Directive: Compliant with (2011/65/EU) requirements
EU REACH Regulation: Does not contain REACH SVHC (1907/2006/EC)
EU ELV Directive: Compliant with 2000/53/EC requirements
