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TXGA连接器厂家 Building Technology Cornerstone
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FBB05002-M10S1003K6MH08

Product number: FBB05002-M10S1003K6MH08
Category: Board to Board Connectors
Specification: Pitch:0.50mm
Type: Plug
Mounting Style: SMT
Angle: 180°Vertical
Circuits: 10Circuits
Status: Active
Description: Board to Board 180°Vertical 0.5mm 10Circuits(H2=0.8mm)
Stock(pcs): 0
Lead time: Estimated delivery date {{2026-05-16|timezoneDate}}
MPQ: 1000
MOQ: 1000
Type: Board to board - Male Pitch:0.5mm (SMT)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Board to board - Male Pitch:0.5mm (SMT)
Mating height 3, 3.5, 4, 4.5, 5, 5.5, 6, 6.5mm
Pitch 0.5mm
Durabiliy (mating cycles max) 30
Electrical
Current - Maximum per Contact 0.50A
Voltage - Maximum 50V
Contact Resistance 40 mΩ Max
Insulation Resistance 100 MΩ Min
Withstanding Voltage 250V AC r.m.s
Temperature Range operating -25ºC~+85ºC
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Gold
Material - Plating Termination Gold
Material - Resin LCP UL94V-0
FBB05002-F18S1003K6MH40
Board to Board 180°Vertical 0.5mm 18Circuits(H1=4mm)
FFH20001-S14S1004K6K-A
Female Header 2mm ,Single row ,14Circuits ,180° Vertical(DIP) ,Gold flash ,PA6T
FPH12701-S06S100452B
Pin Header 1.27mm ,Single row ,6Circuits ,180° Vertical(DIP) ,Gold flash ,PA6T
FPH25452-D12S1154190740B
Pin Header 2.54mm ,Double row ,12Circuits ,180° Vertical(DIP) ,15μ" ,PA6T
FWF10001-S05B24W5M
Wafer 1mm 90°Angle 5Circuits (SMT)
FWF10004-D30B14W5M
Wafer 1mm 90°Angle 30Circuits (SMT)(Gold-Plated)
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