FWF12520-S04S23NAM Wafer 1.25mm ,4Circuits ,180° Vertical(SMT) ,PA9T

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

FWF12520-S04S23NAM.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF12520-S04S23NAM
Category：	Wire to Board Connectors
Specification：	Pitch:1.25mm
Type：	Socket
Mounting Style：	SMT
Angle：	180°Vertical
Circuits：	4Circuits
Status：	Active
Description：	Wafer 1.25mm ,4Circuits ,180° Vertical(SMT) ,PA9T
Stock(pcs)：	1794
Lead time：	1794 In stock Estimated delivery date when out of stock {{2026-03-18\|timezoneDate}}
MPQ：	1000
MOQ：	1
Type：	Wafer 1.25mm 180°Vertical (SMT)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 180°Vertical (SMT)
Pitch	1.25mm
Height	5.3mm
Electrical
Current - Maximum per Contact	1.00A
Voltage - Maximum	125V
Contact Resistance	20 mΩ Max
Insulation Resistance	100 MΩ Min
Withstanding Voltage	250V AC r.m.s
Temperature Range operating	-40ºC~+85ºC
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA9T UL94V-0