FWF20016-S03B22W1B Wafer 2mm Bend Single row 3Circuits (DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

FWF20016.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF20016-S03B22W1B
Category：	Wire to Board Connectors
Specification：	Pitch:2.00mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	90° Angle
Circuits：	3Circuits
Status：	Active
Description：	Wafer 2mm Bend Single row 3Circuits (DIP)
Stock(pcs)：	4963
Lead time：	4963 In stock Estimated delivery date when out of stock 2026-01-24
MPQ：	1000
MOQ：	1000
Type：	Wafer 2mm Bend Single row (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (DIP)
Pitch	2.0mm
Height	6.3mm
Electrical
Current - Maximum per Contact	2.00A
Voltage - Maximum	100V
Contact Resistance	10 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	800V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Gold/Tin
Material - Plating Termination	Gold/Tin
Material - Resin	PA6T UL94V-0/PA66 UL94V-2