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FWF20016 Wafer 2mm 90°Angle (DIP)

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Specification
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Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 2.0mm
Height 6.3mm
Electrical
Current - Maximum per Contact 2.00A
Voltage - Maximum 100V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Gold/Tin
Material - Plating Termination Gold/Tin
Material - Resin PA6T UL94V-0/PA66 UL94V-2

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FWF20016 Wafer 2mm 90°Angle (DIP)

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