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FWF20016-S16B22W1B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF20016.pdf
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Product number: FWF20016-S16B22W1B
Category: Wire to Board Connectors
Specification: Pitch:2.00mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 16Circuits
Status: Active
Description: Wafer 2mm ,16Circuits ,90° Angle(DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2026-01-28
MPQ: 1000
MOQ: 1000
Type: Wafer 2mm Bend Single row (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 2.0mm
Height 6.3mm
Electrical
Current - Maximum per Contact 2.00A
Voltage - Maximum 100V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Gold/Tin
Material - Plating Termination Gold/Tin
Material - Resin PA6T UL94V-0/PA66 UL94V-2
FBB08001-F24S1003K6MH45
Board to Board 180°Vertical 0.8mm 24Circuits(H1=4.5mm)
FBH25403-D06S1004K6M
Box Header 2.54mm ,6Circuits ,180° Vertical(SMT) ,PA9T
FFC10001-08SBA124W5M
FPC/FFC connector 1mm UpperContact 8Circuits(H2.7)(SMT)
FHG08002-S08M6W5B
Wire to board housing 0.8mm ,8Circuits ,PA46
FPH127S2-D24S100403B
Pin Header 1.27mm 180°Vertical Double row 24Circuits(SMT)
FWF25003-S10S22W5B
Wafer 2.5mm 180°Vertical 10Circuits (DIP)
Quantity Unit Price
1+ $0.087132
10+ $0.081543
50+ $0.070364
100+ $0.064775
500+ $0.053596

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Sales Drawings

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