FWF20023-S09S23W5M Wafer 2mm ,9Circuits ,180° Vertical(SMT)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications：

Product specification.pdf

Sales Drawings：

FWF20023 Series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

Export Page to PDF

Product number：	FWF20023-S09S23W5M
Category：	Wire to Board Connectors
Specification：	Pitch:2.00mm
Type：	Socket
Mounting Style：	SMT
Angle：	180°Vertical
Circuits：	9Circuits
Status：	Discontinued
Description：	Wafer 2mm ,9Circuits ,180° Vertical(SMT)
Stock(pcs)：	0
Lead time：	Estimated delivery date {{2026-03-17\|timezoneDate}}
MPQ：	800
MOQ：	800
Type：	Wafer 2mm 180°Vertical (SMT)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 180°Vertical (SMT)
Pitch	2.0mm
Height	8.1mm
Electrical
Current - Maximum per Contact	2.00A
Voltage - Maximum	250V
Contact Resistance	20 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	1000V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Brass
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	LCP UL94V-0