FWF35001-S02B24W5L Wafer 3.5mm 90°Angle 2Circuits (DIP)

✖

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

Drawing-FWF35001.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

Export Page to PDF

Product number：	FWF35001-S02B24W5L
Category：	Wire to Board Connectors
Specification：	Pitch:3.50mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	90° Angle
Circuits：	2Circuits
Status：	Active
Description：	Wafer 3.5mm 90°Angle 2Circuits (DIP)
Stock(pcs)：	0
Lead time：	Estimated delivery date {{2026-10-06\|timezoneDate}}
MPQ：	1000
MOQ：	1000
Type：	Wafer 3.5mm 90°Angle (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (DIP)
Pitch	3.50mm
Height	3.3mm
Electrical
Current - Maximum per Contact	1.00A
Voltage - Maximum	1400V
Contact Resistance	10 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	3800V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	LCP UL94V-0