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FWF63509-S10B22W1K

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
Drawing-FWF63509.pdf
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Product number: FWF63509-S10B22W1K
Category: Wire to Board Connectors
Specification: Pitch:6.35mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 10Circuits
Status: Active
Description: Wafer 6.35mm 90°Angle 10Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2026-02-13
MPQ: 500
MOQ: 1000
Type: Wafer 6.35mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 6.35mm
Height 17.27mm
Electrical
Current - Maximum per Contact 15.00A
Voltage - Maximum 600V
Contact Resistance 3.5 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 5000V AC r.m.s
Temperature Range operating -40℃+105℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
F0CLCT-10004120-02
Crown lamella socket ,∅10 ,Silver plated ,3μm (16mm²)
FHG25017-D16F2K6B
Wire to Wire housing 2.5mm 16Circuits(Black)
FPH25422-D14B100149B
2.54mm 90°Angle Double row 14Circuits(DIP)(Canceled No.3-6,9-12Circuits)
FPH25448-S04S1024190540B
Pin Header 2.54mm ,Single row ,4Circuits ,180° Vertical(DIP) ,2μ" ,PA6T
FPH254F1-D08S100106B
Pin Header 2.54mm 180°Vertical Double row 8Circuits(DIP)
FWF10001-S11B24W5M
Wafer 1mm 90°Angle 11Circuits (SMT)

Sales Drawings

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